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CT RODU UCT E TE P L PROD OBSO ITUTE BST LE S U L322 2 IC POSSIB Data Sheet
ICL3310
July 2004 FN4995.3
+3V to +5.5V, 1 Microamp, 250kbps, RS-232 Transmitter/Receiver
The Intersil ICL3310 contains 3.0V to 5.5V powered RS-232 transmitters/receivers which meet ElA/TIA-232 and V.28/V.24 specifications, even at VCC = 3.0V. Targeted applications are PDAs, Palmtops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. Efficient on-chip charge pumps, coupled with a manual powerdown function reduces the standby supply current to a 1A trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions. This device is fully compatible with 3.3V only systems, mixed 3.3V and 5.0V systems, and 5.0V only systems. The single pin powerdown function (SHDN = 0) disables all the transmitters and receivers, while shutting down the charge pump to minimize supply current drain. Table 1 summarizes the features of the ICL3310, while Application Note AN9863 summarizes the features of each device comprising the ICL32XX 3V family.
Features
* 15kV ESD Protected (Human Body Model) * Low Power, Pin Compatible Upgrade for 5V MAX222, SP310A, and LT1X80/A * Single SHDN Pin Disables Transmitters and Receivers * Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V * Latch-Up Free * On-Chip Voltage Converters Require Only Four External 0.1F Capacitors * Receiver Hysteresis For Improved Noise Immunity * Very Low Supply Current . . . . . . . . . . . . . . . . . . . . 0.3mA * Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps * Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/s * Wide Power Supply Range . . . . . . . Single +3V to +5.5V * Low Supply Current in Powerdown State. . . . . . . . . .<1A
Applications
* Any System Requiring RS-232 Communication Ports - Battery Powered, Hand-Held, and Portable Equipment - Laptop Computers, Notebooks, Palmtops - Modems, Printers and other Peripherals - Digital Cameras - Cellular/Mobile Phones
Pinout
ICL3310 (SOIC) TOP VIEW
NC 1 C1+ 2 V+ 3 18 SHDN 17 VCC 16 GND 15 T1OUT 14 R1IN 13 R1OUT 12 T1IN 11 T2IN 10 R2OUT
Related Literature
* Technical Brief TB363 "Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)"
C1- 4 C2+ 5 C2- 6 V- 7 T2OUT 8 R2IN 9
Part # Information
PART NO. ICL3310CB ICL3310CB-T ICL3310IB ICL3310IB-T TEMP. RANGE (oC) 0 to 70 0 to 70 -40 to 85 -40 to 85 PACKAGE 18 Ld SOIC Tape and Reel 18 Ld SOIC Tape and Reel PKG. NO. M18.3 M18.3 M18.3 M18.3
TABLE 1. SUMMARY OF FEATURES PART NUMBER ICL3310 NO. OF NO. OF Tx. Rx. 2 2 NO. OF MONITOR Rx. (ROUTB) 0 DATA RATE (kbps) 250 Rx. ENABLE FUNCTION? NO READY OUTPUT? NO MANUAL POWERDOWN? YES AUTOMATIC POWERDOWN FUNCTION? NO
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2001, 2002, 2004. All Rights Reserved
ICL3310 Pin Descriptions
PIN VCC V+ VGND C1+ C1C2+ C2TIN TOUT RIN ROUT SHDN System power supply input (3.0V to 5.5V). Internally generated positive transmitter supply (+5.5V). Internally generated negative transmitter supply (-5.5V). Ground connection. External capacitor (voltage doubler) is connected to this lead. External capacitor (voltage doubler) is connected to this lead. External capacitor (voltage inverter) is connected to this lead. External capacitor (voltage inverter) is connected to this lead. TTL/CMOS compatible transmitter Inputs. RS-232 level (nominally 5.5V) transmitter outputs. RS-232 compatible receiver inputs. TTL/CMOS level receiver outputs. Active low input to shut down transmitters, receivers, and on-board power supply, to place device in low power mode. FUNCTION
Typical Operating Circuits
ICL3310
C3 (OPTIONAL CONNECTION, NOTE) +3.3V to +5V + 0.1F 2 + 4 5 + 6 12 C1+ C1C2+ C2T1 T2 V15 8 T2OUT 14 R1 10 R2OUT R2 5k 5k 9 R2IN RS-232 LEVELS 17 VCC 3 V+ 7 + + C3 0.1F C4 0.1F + T1OUT R1IN SHDN GND 16 18 VCC
C1 0.1F C2 0.1F
T1IN T2IN TTL/CMOS LOGIC LEVELS R1OUT
11
13
NOTE: The negative terminal of C3 can be connected to either VCC or GND.
2
ICL3310
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V V- to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V Input Voltages TIN, SHDN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2V ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Information
Thermal Resistance (Typical, Note 1)
JA (oC/W)
18 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (Lead Tips Only)
Operating Conditions
ICL3310CX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC ICL3310IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1F; Unless Otherwise Specified. Typicals are at TA = 25oC TEST CONDITIONS TEMP (oC) MIN TYP MAX UNITS
PARAMETER DC CHARACTERISTICS Supply Current, Powerdown SHDN = GND
25 Full
-
0.1 0.3
10 50 3.0
A A mA
Supply Current, Enabled
All Outputs Unloaded, SHDN = VCC, VCC = 3.15V
Full
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Low Input Logic Threshold High Input Leakage Current Output Leakage Current Output Voltage Low Output Voltage High RECEIVER INPUTS Input Voltage Range Input Threshold Low VCC = 3.3V VCC = 5.0V Input Threshold High VCC = 3.3V VCC = 5.0V Input Hysteresis Input Resistance TRANSMITTER OUTPUTS Output Voltage Swing Output Resistance Output Short-Circuit Current Output Leakage Current VOUT = 12V, VCC = 0V or 3V to 5.5V, SHDN = GND All Transmitter Outputs Loaded with 3k to Ground VCC = V+ = V- = 0V, Transmitter Output = 2V Full Full Full Full 5.0 300 7 5.4 10M 35 10 V mA A Full 25 Full 25 Full Full Full -25 0.6 0.8 0.2 3 1.2 1.5 1.5 1.8 0.5 5 25 2.4 2.4 1 7 V V V V V V k TIN, SHDN TIN, SHDN TIN, SHDN SHDN = VCC IOUT = 3.2mA IOUT = -1.0mA Full Full Full Full Full Full 2.4 0.01 0.05 0.8 1.0 10 0.4 V V A A V V
VCC -0.6 VCC -0.1
3
ICL3310
Electrical Specifications Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1F; Unless Otherwise Specified. Typicals are at TA = 25oC (Continued) TEST CONDITIONS TEMP (oC) MIN TYP MAX UNITS
PARAMETER TIMING CHARACTERISTICS Maximum Data Rate Transmitter Propagation Delay
RL = 3k, CL = 1000pF, One Transmitter Switching Transmitter Input to Transmitter Output, CL = 1000pF Receiver Input to Receiver Output, CL = 150pF tPHL tPLH tPHL tPLH
Full Full Full Full Full 25 25 25 25
250 4 6
500 0.6 0.7 0.2 0.3 50 600 100 100 -
3.5 3.5 1 1 -
kbps s s s s s ns ns ns V/s V/s
Receiver Propagation Delay
Transmitter Output Enable Time Transmitter Output Disable Time Transmitter Skew Receiver Skew Transition Region Slew Rate
From SHDN Rising Edge to TOUT = 3V From SHDN Falling Edge to TOUT = 5V tPHL - tPLH (Note 2) tPHL - tPLH RL = 3k to 7k, Measured From 3V to -3V or -3V to 3V VCC = 3.3V, CL = 150pF to 2500pF VCC = 4.5V, CL = 150pF to 2500pF
25 25
ESD PERFORMANCE RS-232 Pins (TOUT, RIN) Human Body Model IEC1000-4-2 Contact Discharge IEC1000-4-2 Air Gap Discharge All Other Pins NOTE: 2. Transmitter skew is measured at the transmitter zero crossing points. Human Body Model 25 25 25 25 15 8 >8 3 kV kV kV kV
Detailed Description
ICL3310 interface ICs operate from a single +3V to +5.5V supply, guarantee a 250kbps minimum data rate, require only four small external 0.1F capacitors, feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: The charge pump, the transmitters, and the receivers.
Transmitters
The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip 5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages. All transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see Table 2). These outputs may be driven to 12V when disabled. All devices guarantee a 250kbps data rate for full load conditions (3k and 1000pF), VCC 3.0V, with one transmitter operating at full speed. Under more typical conditions of VCC 3.3V, RL = 3k, and CL = 250pF, one transmitter easily operates at 900kbps.
Charge-Pump
Intersil's new ICL3310 utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate 5.5V transmitter supplies from a VCC supply as low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the 10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1F capacitors for the voltage doubler and inverter functions at VCC = 3.3V. See the "Capacitor Selection" section, and Table 3 for capacitor recommendations for other operating conditions. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings.
4
ICL3310
Transmitter inputs float if left unconnected (there are no pullup resistors), and may cause ICC increases. Connect unused inputs to GND for the best performance.
TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE SHDN TRANSMITTER RECEIVER INPUT OUTPUTS OUTPUTS MODE OF OPERATION H L Active High-Z Active High-Z Normal Operation Manual Powerdown
Powerdown Functionality
The already low current requirement drops significantly when the device enters powerdown mode. In powerdown, supply current drops to 1A, because the on-chip charge pump turns off (V+ collapses to VCC, V- collapses to GND), and the transmitter and receiver outputs three-state. This micro-power mode makes these devices ideal for battery powered and portable applications.
Software Controlled (Manual) Powerdown
The ICL3310 may be forced into its low power, standby state via a simple shutdown (SHDN) pin (see Figure 4). Driving this pin high enables normal operation, while driving it low forces the IC into it's powerdown state. The time required to exit powerdown, and resume transmission is less than 50s. Connect SHDN to VCC if the powerdown function isn't needed.
VCC VCC CURRENT FLOW VOUT = VCC Rx
Receivers
The ICL3310 contains standard inverting receivers that three-state via the SHDN control line. Receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral's protection diodes (see Figures 2 and 3). All the receivers convert RS-232 signals to CMOS output levels and accept inputs up to 30V while presenting the required 3k to 7k input impedance (see Figure 1) even if the power is off (VCC = 0V). The receivers' Schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions.
VCC RXIN -25V VRIN +25V GND 5k RXOUT GND VROUT VCC
VCC
POWERED DOWN UART Tx GND SHDN = GND OLD RS-232 CHIP
FIGURE 1. INVERTING RECEIVER CONNECTIONS FIGURE 2. POWER DRAIN THROUGH POWERED DOWN PERIPHERAL
Low Power Operation
This 3V device requires a nominal supply current of 0.3mA, even at VCC = 5.5V, during normal operation (not in powerdown mode). This is considerably less than the 11mA current required by comparable 5V RS-232 devices, allowing users to reduce system power simply by replacing the old style device with the ICL3310.
VCC
TRANSITION DETECTOR TO WAKE-UP LOGIC VCC VICL3310
Low Power, Pin Compatible Replacement
Pin compatibility with existing 5V products (e.g., MAX222), coupled with the wide operating supply range, make the ICL3310 a potential lower power, higher performance dropin replacement for existing 5V applications. As long as the 5V RS-232 output swings are acceptable, and transmitter pull-up resistors aren't required, the ICL3310 should work in most 5V applications. When replacing a device in an existing 5V application, it is acceptable to terminate C3 to VCC as shown on the "Typical Operating Circuit". Nevertheless, terminate C3 to GND if possible, as slightly better performance results from this configuration.
RX POWERED DOWN UART
VOUT = HI-Z
TX
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN
5
ICL3310
SHDN PWR MGT LOGIC
5V/DIV.
SHDN T1
ICL3310
2V/DIV.
I/O UART CPU
T2 VCC = +3.3V C1 - C4 = 0.1F TIME (20s/DIV.)
FIGURE 5. TRANSMITTER OUTPUTS WHEN EXITING POWERDOWN FIGURE 4. CONNECTIONS FOR MANUAL POWERDOWN
High Data Rates
The ICL3310 maintain the RS-232 5V minimum transmitter output voltages even at high data rates. Figure 6 details a transmitter loopback test circuit, and Figure 7 illustrates the loopback test result at 120kbps. For this test, all transmitters were simultaneously driving RS-232 loads in parallel with 1000pF, at 120kbps. Figure 8 shows the loopback results for a single transmitter driving 1000pF and an RS-232 load at 250kbps. The static transmitters were also loaded with an RS-232 receiver.
VCC 0.1F +
Capacitor Selection
The charge pumps require 0.1F or greater capacitors for operation with 3.3V VCC 5.5V. Increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2 , C3 , and C4 can be increased without increasing C1's value, however, do not increase C1 without also increasing C2 , C3 , and C4 to maintain the proper ratios (C1 to the other capacitors). When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor's equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-.
+ C1
C1+ C1-
VCC
V+
+ C3
ICL3310
Power Supply Decoupling
In most circumstances a 0.1F bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1. Connect the bypass capacitor as close as possible to the IC.
+ C2
C2+ C2TIN ROUT TOUT
V-
C4 +
RIN 5k
1000pF
Transmitter Outputs when Exiting Powerdown
Figure 5 shows the response of two transmitter outputs when exiting powerdown mode. As they activate, the two transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients. Each transmitter is loaded with 3k in parallel with 2500pF. Note that the transmitters enable only when the magnitude of the supplies exceed approximately 3V.
VCC
SHDN
FIGURE 6. TRANSMITTER LOOPBACK TEST CIRCUIT
6
ICL3310
5V/DIV. T1IN
Interconnection with 3V and 5V Logic
The ICL3310 directly interface with most 5V logic families, including ACT and HCT CMOS. See Table 3 for more information on possible combinations of interconnections.
TABLE 3. LOGIC FAMILY COMPATIBILITY WITH VARIOUS SUPPLY VOLTAGES VCC SYSTEM POWER-SUPPLY SUPPLY VOLTAGE VOLTAGE (V) (V)
VCC = +3.3V C1 - C4 = 0.1F 5s/DIV.
T1OUT
R1OUT
COMPATIBILITY Compatible with all CMOS families. Compatible with all TTL and CMOS logic families. Compatible with ACT and HCT CMOS, and with TTL. Incompatible with AC, HC, or CD4000 CMOS.
3.3 5 5
3.3 5 3.3
FIGURE 7. LOOPBACK TEST AT 120kbps
5V/DIV. T1IN
T1OUT
R1OUT VCC = +3.3V C1 - C4 = 0.1F 2s/DIV.
FIGURE 8. LOOPBACK TEST AT 250kbps
Typical Performance Curves
6.0 TRANSMITTER OUTPUT VOLTAGE (V) 4.0 2.0 1 TRANSMITTER AT 250kbps 1 TRANSMITTER AT 30kbps 0 -2.0 -4.0 -6.0
VCC = 3.3V, TA = 25oC
25 VOUT+ 20 SLEW RATE (V/s)
15 -SLEW +SLEW 10
VOUT 5
0
1000
2000
3000
4000
5000
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
FIGURE 9. TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE
FIGURE 10. SLEW RATE vs LOAD CAPACITANCE
7
ICL3310 Typical Performance Curves
45 40 SUPPLY CURRENT (mA) 35 30 25 20 15 10 5 0 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 20kbps 120kbps SUPPLY CURRENT (mA) 250kbps
VCC = 3.3V, TA = 25oC (Continued)
3.5 3.0 2.5 2.0 1.5 1.0 0.5 NO LOAD ALL OUTPUTS STATIC
SUPPLY VOLTAGE (V)
FIGURE 11. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA
FIGURE 12. SUPPLY CURRENT vs SUPPLY VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 338 PROCESS: Si Gate CMOS
8
ICL3310 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M18.3 (JEDEC MS-013-AB ISSUE C)
18 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 2.35 0.10 0.33 0.23 11.35 7.40 MAX 2.65 0.30 0.51 0.32 11.75 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0926 0.0040 0.013 0.0091 0.4469 0.2914
MAX 0.1043 0.0118 0.0200 0.0125 0.4625 0.2992
A1 B C D E

A1 0.10(0.004) C
e H h L N
0.050 BSC 0.394 0.010 0.016 18 0o 8o 0.419 0.029 0.050
1.27 BSC 10.00 0.25 0.40 18 0o 10.65 0.75 1.27
e
B 0.25(0.010) M C AM BS
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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